Our Product Range
All of the products within the Teledyne Reynolds range have full material and build traceability, and are subject to rigorous in-process checks and final inspection testing.
Our 6 core product groups are
: Cable assembly, custom design and manufacturing capability with a range of specialist connectors and wires. Also offering spark gaps, high voltage mica capacitors and specialised electro-ceramic products. From DC to 100KV and rated for operation up to 70,000ft, with a range of use from -55°C to +125°C. Applications include medical, industrial, armoured vehicles, commercial and military unmanned platforms and ordnance management.
: Teledyne Reynolds offers a highly specialised design, manufacture and test capability, which incorporates high and low voltage, fibre optics, data, RF and video links in any combination to meet exact interconnect requirements without compromise.
RF & Microwave
: Teledyne Reynolds offers a range of custom and catalogue specified flexible, semi-rigid and rigid RF and microwave cable assemblies operating to a maximum of 50GHz.
Initiation and Ordnance
: A highly specialised area of expertise is the Teledyne Reynolds initiation and ordnance range of capabilities and products. Engineering led solutions are developed for customers on an application by application basis to ensure an exact match to customer needs. Safety is paramount in the design, manufacturing and test processes used in delivering safe, reliable product to customers.
Teledyne Reynolds offers custom designed and catalogue specified high voltage cable assemblies, connectors and wire for payload and launcher applications. The custom designed products are manufactured in our clean facility, where specialised test requirements outside of our own test capabilities form part of a programme, the requirement is contracted to third parties including the Rutherford Appleton Laboratories.
: Teledyne Reynolds offers a highly specialised design, manufacture and test capability which incorporates high and low voltage, fibre optics, data, RF and video links in any combination to meet exact interconnect requirements without compromise.